HFE-7300

High boiling point, high thermal stability, semiconductor grade high-end cooling and cleaning

Category: Foaming Agent


Novec HFE-7300

 

• Boiling point: 98 ℃ (highest among the four)

• Slowest evaporation, can stay on the surface of the workpiece for a longer period of time

Excellent thermal stability, does not decompose under high temperature conditions

• High insulation, high cleanliness, suitable for semiconductor grade applications

Suitable for: precision cooling, hard disk lubrication, semiconductor cavity cooling, high-end cleaning

The highest purity and extremely low evaporation residue

Typical features: high boiling point, high thermal stability, ultra-high cleanliness, high-end cooling

• Colorless, transparent, low odor, low viscosity liquid

Completely non flammable, no flash point, safe to use

Ozone depletion potential (ODP)=0, environmentally friendly

• Extremely low surface tension, strong penetration, able to enter small gaps

• Evaporative residue free, non absorbent, good insulation properties

Excellent compatibility with metals, plastics, and rubber


Related product